A gigantic 6.8 inch screen has been seen on the Hisense X1 at the CES
2014. This Hisense X1 is going to be the flagship model which has been
unveiled at the event by the Chinese electronic manufacturer Hisense
coming with 6.8 inch screen with 1080p IPS display.
This device packs a whooping 6.8 inch screen with 1080p IPS display close to the size of many tablets in the market. The pixel density is 324 ppi that can be enjoyed for gaming and watching videos on the big screen. This is powered by a Snapdragon 800 processor and has a 13 MP shooter on the back and runs on the latest Android 4.4 KitKat Operating system with light skin on top, other specifications are not yet known but the available details are enough to make it a high end device.
This device will be featuring in to the Chinese market at the early state and later will be moved to US. Hisense has been talking to two US carriers for the launch of the device in US. The Hisense X1 is built up all with plastic and all the hardware buttons can be found on the right side of the device. The huge phone is said to have a 9.7 mm thick body but still going to be a huge device for a Smart Phone.
The device does not feature LTE connectivity, it is just HSPA + it is said that the company do have a LTE capable device for the US market but it was not showcased in the event. Although the specifications which are on the high end, we can expect this device to be a mid range device as the quality of the body made by plastic shows.
So this will be great news for all those who like big screens for their phones, but folks you need to have bigger pockets! Are you planning to get this device? drop your comments and stay connected for more updates.
This device packs a whooping 6.8 inch screen with 1080p IPS display close to the size of many tablets in the market. The pixel density is 324 ppi that can be enjoyed for gaming and watching videos on the big screen. This is powered by a Snapdragon 800 processor and has a 13 MP shooter on the back and runs on the latest Android 4.4 KitKat Operating system with light skin on top, other specifications are not yet known but the available details are enough to make it a high end device.
This device will be featuring in to the Chinese market at the early state and later will be moved to US. Hisense has been talking to two US carriers for the launch of the device in US. The Hisense X1 is built up all with plastic and all the hardware buttons can be found on the right side of the device. The huge phone is said to have a 9.7 mm thick body but still going to be a huge device for a Smart Phone.
The device does not feature LTE connectivity, it is just HSPA + it is said that the company do have a LTE capable device for the US market but it was not showcased in the event. Although the specifications which are on the high end, we can expect this device to be a mid range device as the quality of the body made by plastic shows.
So this will be great news for all those who like big screens for their phones, but folks you need to have bigger pockets! Are you planning to get this device? drop your comments and stay connected for more updates.
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